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Layout Engineer
Hangzhou R&D
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Contact Person: 寿女士
Tel: 0571-89966911
Email: hr@relmon.com

Position Requirements:

1.Bachelor’s degree or higher in Microelectronics or a related field.

2.Familiar with integrated circuit (IC) device principles and knowledge of IC manufacturing processes.

3.Passionate about IC layout design and committed to pursuing a long-term career in this field.

4.Strong communication skills and a team player with collaborative spirit.

5.High sense of responsibility and ability to work independently.

6.Proficient in English (listening, speaking, reading, and writing).

(Salary negotiable for candidates with prior work experience.)

Job Responsibilities:

1.Perform layout design according to circuit designers’ requirements and specified process rules.

2.Optimize layouts for performance, cost, test feasibility, and packaging feasibility.

3.Conduct DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for designed products.

4.Optimize layouts, output data, and prepare product documentation.

5.Create packaging diagrams.

6.Outstanding fresh graduates may also be considered.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System:

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Analog IC Design Engineer
Hangzhou R&D 5+years
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Contact Person: 寿女士
Tel: 0571-89966911
Email: hr@relmon.com

Position Requirements:

Responsible for analog circuit design. Candidates should have a graduate degree (or above) in Microelectronics, Integrated Circuits, Circuit and Systems, or related fields; or a bachelor's degree with 5+ years of relevant work experience.

1.Solid theoretical knowledge of analog circuits and basic understanding of digital circuit theory.

2.Familiar with device models, parameters, and basic structures of BIPOLAR/CMOS/BICMOS/BCD devices.

3.Understanding of IC circuit and layout design processes, as well as manufacturing technologies.

4.Proficient in hardware description languages (e.g., VerilogA) and EDA tools for IC design.

5.Priority given to candidates with successful tape-out experience in op-amps, ADCs, DACs, etc.

6.Strong documentation skills, independent problem-solving, and analytical abilities.

7.Rigorous work ethic, excellent communication skills, and teamwork spirit.

8.Outstanding fresh graduates are welcome.

9.Salary negotiable for experienced candidates.

Job Responsibilities:

1.Design and verify analog IC products or IP modules.

2.Develop detailed product specifications based on project outlines and prepare technical documentation according to project timelines.

3.Collaborate with testing teams to validate IC functionality and performance using verification platforms, identifying issues and proposing improvements.

4.Analyze product issues, optimize performance, and manage product version shrinking and modification.

5.Complete ad-hoc tasks assigned by supervisors.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System:

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Analog IC Design Engineer (Motor Driver Focus)
Hangzhou R&D 5+years
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Contact Person: 寿女士
Tel: 0571-89966911
Email: hr@relmon.com

Position Requirements:

1.Responsible for analog circuit design. Major in Integrated Circuits, Microelectronics, Electronics, or related fields.

2.Master’s degree with project experience or Bachelor’s degree with 5+ years of relevant work experience.

3.Experience in power supply design, DC-DC, motor drivers, audio power amplifiers, etc.

4.Solid theoretical knowledge of analog circuits; basic understanding of digital circuit principles.

5.Familiar with device models, parameters, and structures (BIPOLAR/CMOS/BICMOS/BCD); deep understanding of power drivers.

6.Knowledge of IC design flow, layout design, and manufacturing processes.

7.Proficient in EDA tools for IC design.

8.Detail-oriented with strong communication, presentation, and teamwork skills.

9.Salary negotiable for experienced candidates.

Job Responsibilities:

1.Design and verify analog IC products or IP modules.

2.Develop detailed product specifications based on product outlines; draft technical documentation per project timelines.

3.Collaborate with testing teams to validate IC functionality and performance via verification platforms; identify issues and propose improvements.

4.Analyze product issues, optimize performance, and manage product revisions or miniaturization.

5.Complete ad-hoc tasks assigned by supervisors.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System:

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Digital IC Design Engineer
Hangzhou R&D
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Contact Person: 寿女士
Tel: 0571-89966911
Email: hr@relmon.com

Position Requirements:

1.Bachelor's degree or higher in Electronics, Telecommunications, Circuits and Systems, or related fields; responsible for digital circuit design.

2.Solid theoretical knowledge of digital circuits and basic understanding of analog circuit principles.

3.Proficient in hardware description languages (HDLs) such as Verilog and skilled in using EDA (Electronic Design Automation) tools for IC design.

4.Familiar with the IC development process, including logic design, verification, synthesis, and testing.

5.Priority given to candidates with successful tape-out experience for multiple chips.

6.Priority given to candidates with SOC/MCU development experience and familiarity with MCU architectures and debugging systems.

7.Strong documentation skills, independent problem-solving, and analytical abilities.

8.Detail-oriented work ethic with excellent communication, presentation, and teamwork skills.

9.Outstanding recent graduates are encouraged to apply.

Job Responsibilities:

1.Design and verify digital IC products or IP modules.

2.Develop detailed product specifications based on project outlines.

3.Allocate tasks according to product development timelines and prepare technical documentation.

4.Collaborate with testing teams to validate IC functionality and performance using verification platforms, identifying issues and proposing improvements.

5.Troubleshoot and optimize product performance.

6.Manage version shrinking and modification of products.

7.Complete ad-hoc tasks assigned by supervisors.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System:

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Test Engineer
Hangzhou R&D
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Contact Person: 寿女士
Tel: 0571-89966911
Email: hr@relmon.com

Position Requirements:

1.Bachelor’s degree or higher in Electronics, Computer Science, or related fields; prior experience in integrated circuit (IC) testing is preferred.

2.Understanding of IC structure and operational principles, with basic design and analysis capabilities for analog and digital circuits.

3.Familiarity with IC analog/digital circuits and knowledge of the chip manufacturing process from wafer to mid-testing, packaging, and final testing.

4.Proficiency in testing platforms such as Accotest, Chuangcheon, and V50.

5.Proactive work ethic, strong communication skills, and teamwork spirit.

6.Excellent English reading and writing proficiency.

Job Responsibilities:

1.Develop CP/FT (Chip Probing/Final Test) software and hardware based on product specifications, and prepare relevant documentation.

2.Resolve testing issues at third-party testing facilities.

3.Continuously optimize batch testing to improve yield rates, efficiency, and test coverage.

4.Analyze internal structures of defective units, identify failure root causes, and perform measurements/verifications.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System:

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Total 5 Positions
Apply Now